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PT-60J Series Integrated Multi-service Transmission Equipment

It can support E1,HDSL,optcial and GE uplink

  • Introduction
  • Features
  • Specifications
  • Applications
  • Product Video
  • Installation Video

Product Introduction

The PT-60J integrated multi-service transmission equipment adopts a modular design with dual buses of SDH and Gigabit Ethernet, allowing flexible combination of transmission modules and service modules. The equipment can be flexibly configured into various network topologies according to user requirements, and bear multiple applications such as E1, analog voice (FXS, FXO, E&M), low-speed data and high-speed Ethernet services through transmission networks including overhead lines, E1, Gigabit Ethernet transmission modules, SDH optical transmission modules, and G.703 64K co-directional modules.

The PT-60J integrated multi-service transmission equipment is designed with localized chips and available in two chassis configurations. Among them, the Integrated Multi-service Transmission Equipment Model Ⅰ has a height of 4U, and Model Ⅱ has a height of 2U. Both adopt a backplane bus card-inserted structure, where all functional units inside the chassis are installed in the form of plug-in cards. It features a fully enclosed chassis design with fanless conductive heat dissipation. The entire chassis supports front-end maintenance, and all functional unit cards can be inserted, pulled out, maintained and replaced from the front.

The chassis structure is mainly made of rust-proof aluminum processed by milling and then welded. A large area of heat dissipation fins are designed on the outside of the chassis to facilitate conductive and radiative heat dissipation of the whole equipment. The temperature field distribution, mechanical deformation characteristics, and resistance to vibration and impact under specific environments comply with relevant standards.

Product Features

a) Adoption of Localized and Independently Controllable Technologies

All components of the equipment, including FPGA chips, microprocessors, interface chips, discrete components and connectors, are selected from mature products of domestic manufacturers.

b) Dual-bus Architecture for Enhanced Scalability and Flexibility

The equipment adopts a dual-bus architecture of 2.5G SDH and Gigabit Ethernet. The dual buses run through all user slots of the equipment. Service transmission, reception and decomposition can be implemented via the SDH bus and Gigabit Ethernet bus on demand, which greatly improves the flexibility, reliability and transmission efficiency of the equipment's service interface configuration.

c) Flexible Configuration and Hot-swappable Architecture

With the objectives of achieving integration, high availability, high reliability, high credibility, scalability and flexible configuration for the integrated multi-service transmission equipment, the overall architecture of the equipment is designed in compliance with such features as board hot-swapping and flexible configuration during the R&D phase. It adopts an intelligent chassis management method based on a custom high-speed bus. Through highly integrated hardware design and in-depth hardware-software adaptation, the system is endowed with capabilities of easy upgrade, easy maintenance, easy support and scalability.

d) Programmable Devices for Core Logic Functions

Domestic large-scale FPGA devices are mainly adopted in the solution design to implement digital logic circuit functions. The application of large-scale FPGAs can significantly reduce the use of dedicated chips, which is conducive to the localization of products and the component availability in the production process, reflecting the advancement of this technical solution.

e) Fully Enclosed Fanless Conductive Cooling Design

The fully enclosed fanless conductive cooling design reduces the equipment size, greatly improves the environmental adaptability and reliability indicators of the equipment, and significantly lowers the equipment noise level.

f) Dual Redundant Hot Backup Design

Both the power supply module and the main control module adopt a dual redundant hot backup design, which substantially enhances the operational reliability of the equipment.

g) Modular and Serialized Design

A series of universal modules are designed, and serialized products with different functions and performance indicators are formed through the combination of different modules. The equipment chassis allows various modules to be inserted into any transmission/service slot. Users can adjust the configuration of transmission modules and service modules at any time according to actual application scenarios, thereby reducing the procurement of new equipment and demonstrating excellent economic efficiency.

h) Front Maintenance and Rear Cabling Architecture

All equipment modules support front-side plugging and unplugging for convenient maintenance; all interfaces adopt rear-side cabling, which is conducive to vehicle-mounted or equipment room installation, featuring excellent practicability.

i) Compliance with Relevant National Military Standard (GJB) Requirements

The equipment complies with relevant GJB requirements for vibration, shock, damp heat, insulation resistance, dielectric strength, leakage current, electromagnetic compatibility, etc.

Product Specifications

Equipment protection Cross-connection matrix and clock unit 1+1 protection
Uplink and downlink interface card 1+1 protection
Power 1+1 protection
E1 Interface Bit rate: 2.048Mbps ±50ppm
Code type: HDB3 code, G.703 standard
Input impedance: 75W or 120W
Frame structure: G.704, G.706
Jitter: G.742, G.823
Clock port 1 channel external input clock, 1 channel output. (2Mbit/s or 2MHz is optional. 120Ω interface
Clock working mode Lock mode, holdover mode or Free-run mode
Power Supply Input voltage: 220VAC
Voltage range: 176VAC ∼ 264VAC
Power consumption: <200W
Operation Environment Working temperature: -10°C ~ 50°C
Working humidity: 5% ~ 95 % (non-condensed)
Storage temperature: -40°C ~ +80°C

Product Applications

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Product Video

Installation Video

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